 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| OZ826 Dual-Phase DC-DC Controller for AMD Mobile CPU FEATURES * * * * * * * * * * * * * * * * * * * Dual-phase DC-DC controller with integrated drivers 6 bit AMD VID codes compatible 1% output voltage accuracy 6V to 24V input supports 2s to 5s battery power Voltage Feed-Forward Compensation High efficiency, up to 94% High light-load efficiency: 80% at 200mA Non-audio skip mode Constant Ripple-Current topology facilitates optimum inductor size Supports 60A output current Ultra-fast transient recovery Adjustable load line support Slew control at start-up and OTF VID changes True differential output voltage remote sensing AMD compliant Power Good signal VIN & VDDA Undervoltage Lockout Protection Latched over-voltage protection Cycle-by-cycle Overcurrent protection with latched timeout Small, thin 5x5 QFN32 package GENERAL DESCRIPTION OZ826 is a DC/DC controller specifically developed to support the design of power supplies for AMD mobile microprocessors supporting the 6 bit VID codes (see Table 1). Its high efficiency under both light and heavy load conditions, DC accuracy, remote voltage sensing and excellent transient response make it a good choice for low voltage CPUs. The core topology is based on a constant-ripple current sync-buck controller with integrated drivers. The voltage feed-forward compensation ensures a high rejection of input voltage transients. Overvoltage Protection (OVP) acts when the output voltage exceeds the 1.8V threshold. This protection condition is latched and the shutdown occurs. After an OVP event, the EN pin should be toggled or VDDA cycled to restart the circuit. Under Voltage Lockout (UVLO) circuit monitors both VDDA and VIN. Shut down occurs when VDDA falls below 4.2V or VIN is less than typically 4.8V. The output is protected against overload by a cycle-bycycle Overcurrent Protection (OCP) circuit. Its limit is useradjustable. Maximum OCP timeout is typically 1ms. The Power Good (PG) signal is open drain unless the output voltage drops more than 250mV off the set VID. At start-up the output voltage ramps up in a controlled manner with an externally adjustable slew rate. APPLICATIONS Notebook CPU power supplies ORDERING INFORMATION Part Number OZ826LN Temp Range 0oC to 85oC Package 32 QFN 5x5mm SIMPLIFIED APPLICATION DIAGRAM PIN DIAGRAM www..com 07/31/08 Copyright (c) 2005-2008 by O2Micro Patent #6,844,710 OZ826-SF-v1.0 All Rights Reserved Page 1 PIN DESCRIPTION No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Name NC COMPV VREF TSET PSI_L EN PG HDR2 LX2 BST2 LDR2 VDDP GNDP LDR1 BST1 LX1 HDR1 VIN VID0 VID1 VID2 VID3 VID4 VID5 NC ILIM VDDA SLEW CSP CSN RSP RSN GNDA I/O I/O O I I I O O P P O P P O P P O I I I I I I I I P I/O I I I I P Type Analog Analog Analog Digital Digital Digital Digital Power Power Digital Power Power Digital Power Power Digital Analog Digital Digital Digital Digital Digital Digital Analog Power Analog Analog Analog Analog Analog Power Description No internal connection Compensation pin. Requires a capacitor to analog ground 1.55V, +/-1% precision reference voltage Adjusts the on time interval Enables skip mode of operation when asserted low, 120k internal pull down resistor Enables the controller operation. When asserted high, initiates the startup sequence. 120k internal pull down resistor Power good open drain output. It only provides an indication that the output voltage is within VID set voltage -250mV Output of the high side driver of phase 2 Inductor switching node for phase 2 Positive supply for the high side driver of phase 2. A 0.22F capacitor should be placed between BST2 and LX2 Output of the low side driver of phase 2 Power supply for the low side drivers Power ground for low side drivers Output of the low side driver of phase 1 Positive supply for the high side driver of phase 1. A 0.22F capacitor should be placed between BST1 and LX1 Inductor switching node for phase 1 Output of the high side driver of phase 1 Sensing pin for the input voltage of the power stage Voltage Identification pin, bit 0, 120k internal pull down resistor Voltage Identification pin, bit 1, 120k internal pull down resistor Voltage Identification pin, bit 2, 120k internal pull down resistor Voltage Identification pin, bit 3, 120k internal pull down resistor Voltage Identification pin, bit 4, 120k internal pull down resistor Voltage Identification pin, bit 5, 120k internal pull down resistor No internal connection Sets the current limit threshold +5V supply for the controller analog circuits. Controls the slew rate of the output voltage during start up and OTF VID code change Non-inverting current sense pin; also provides voltage feedback information Inverting current sense pin Non-inverting voltage remote sense pin Inverting voltage remote sense pin Ground for the controller analog circuits OZ826-SF-v1.0 Page 2 www..com OZ826 TYPICAL APPLICATION SCHEMATIC R1 M1 BSC119N03S M2 BSC119N03S CIN1 VID2 VID3 VID4 VID5 HDR1 LX1 M3 BSC22N03S 24 23 22 21 20 19 +5V U1 18 17 C4 0.22uF/10V D1 +5V 16 15 14 13 12 11 10 9 1uF/10V D2 M5 BSC119N03S M6 BSC119N03S CIN3 10uF/25V 33 1 2 3 4 5 6 7 8 VREF MBR0540 C12 0.22uF/10V R11 35k R12 10k 0.22uF/10V COMPV C14 HDR2 LX2 M7 BSC22N03S M8 BSC22N03S D6 R15 90k NO POP C20 100nF/10V 15MQ040N + C15 330uF C19 10nF/10V R14 15.8k C21 1nF/10V MICROPROCESSOR +5V LDR2 PSI_L R17 1k9 EN C22 47uF/6.3V C23 47uF/6.3V C24 47uF/6.3V C25 47uF/6.3V + C16 330uF L2 0.6uH/30A 1.5mohm CSN CIN4 10uF/25V C11 10nF/10V R9 1.5k BST2 C10 LDR1 C7 22pF/10V 470nF/10V 2.2 BST1 MBR0540 CSP C6 R8 15MQ040N D3 M4 BSC22N03S R3 1.5k C3 10nF/25V 10uF/25V CIN2 10uF/25V VID0 VID1 R5 22 ILIM VDDA SLEW CSP CSN C8 1uF/10V C9 10nF/10V VDDFB_H VDDFB_L 25 26 27 28 29 30 31 32 NC ILIM VDDA SLEW CSP CSN RSP RSN HDR1 VID5 VID4 VID3 VID2 VID1 VID0 VIN COMPV GNDA ILIM TSET HDR2 VREF TSET PSIB PG NC EN www..com OZ826 VIN VDC 1k L1 0.6uH/30A 1.5mohm LX1 BST1 LDR1 GNDP OZ826 VDDP LDR2 BST2 LX2 + C17 330uF + C18 330uF VDD_CORE VDDFB_H R16 665 VDDFB_L R18 665 PWRGD_VDD Typical Application Schematic: Dual Phase AMD Mobile CPU Core Power Supply with 60A Load Current Capability OZ826-SF-v1.0 Page 3 OZ826 BILL OF MATERIALS Item Qty Reference Value Vendor Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 4 1 3 1 1 2 3 4 1 1 4 2 2 2 4 4 1 2 1 1 1 1 1 2 1 1 CIN1,CIN2,CIN3,CIN4 C3 C4, C12, C14 C6 C7, C8, C10 C9, C11, C19 C15, C16, C17, C18 C20 C21 C22, C23, C24, C25 D1, D2 D3, D4 L1, L2 M1, M2, M5, M6 M3, M4, M7, M8 R1 R3, R9 R5 R8 R11 R12 R14 R16, R18 R17 U1 10F/25V 10nF/50V 220nF/10V 470nF/10V 22pF/10V 1F/10V 10nF/10V 330F/2.5V 100nF 1nF/10V 47uF/6.3V MBR0540 15MQ040N 0.6H/30A 1.5m BSC119N03S BSC022N03S 1k 1.5k 22 2.2 35k 10k 15.8k 665 1.9k OZ826 C4532X7R1E106M TDK 250S43X5R106M Johanson Dielectrics Ceramic - X7R or X5R Ceramic - X7R or X5R Ceramic - X7R or X5R Ceramic - X7R or X5R C1608X5R1A105K TDK 100R14X5R105M Johanson Dielectrics Ceramic - X7R or X5R SPCAP, POSCAP, OSCON Ceramic - X7R or X5R Ceramic - X7R or X5R 630S43X5R476MJohanson Dielectrics International Rectifier, Vishay Siliconix International Rectifier, Vishay Siliconix FDH1055 0R56 TOKO Infineon Infineon Any Any Any Any Any Any Any Any Any O2Micro, Inc. COMPONENT SUPPLIERS Manufacturer Power MOSFETs Fairchild Semiconductor International Rectifier Siliconix (Vishay) Philips Infineon Magnetics/Inductors Coilcraft Coiltronics TOKO Sumida Capacitors www..com Sanyo Kemet Other Components TDK Taiyo Yuden Contact Information Phone 888-522-5372 (USA) 310-322-3331 (USA) 203-268-6261 (USA) 408-474-8142 (USA) 858-526-2201 (USA) 800-322-2645 (USA) 561-752-5000 (USA) 858-675-8013 (USA) 408-982-9660 (USA) 65-6281-3226 (Singapore) 408-986-0424 (USA) 847-803-6100 (USA) 81-3-5201-7241 (Japan) 03-3667-3408 (Japan) 408-573-4150 (USA) Website www.fairchildsemi.com www.irf.com www.vishay.com www.semiconductors.philips.com www.infineon.com www.coilcraft.com www.coiltronics.com www.tokoam.com www.sumida.com www.secc.co.jp www.kemet.com www.component.tdk.com www.t-yuden.com OZ826-SF-v1.0 Page 4 OZ826 PACKAGE INFORMATION - 32 PIN QFN Exposed pad is GNDA (pin 33) and must be soldered to PCB 1 2 3 1 2 3 www..com Rth j-a (QFN-32 5x5mm package) = 26C/W OZ826-SF-v1.0 Page 5 OZ826 DIMENSION TABLE SYMBOL D1 E1 L1 P1 F SPECIFICATION 32L QLP 5X5 BODY RECOMMENDED LANDING PATTERN D1 E1 0.25 0.50 0.94 2.8 4.25 PIN 1 P1 F www..com OZ826-SF-v1.0 Page 6 OZ826 IMPORTANT NOTICE No portion of O2Micro specifications/datasheets or any of its subparts may be reproduced in any form, or by any means, without prior written permission from O2Micro. O2Micro and its subsidiaries reserve the right to make changes to their datasheets and/or products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. O2Micro warrants performance of its products to the specifications applicable at the time of sale in accordance with O2Micro's standard warranty. Testing and other quality control techniques are utilized to the extent O2Micro deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customer acknowledges that O2Micro products are not designed, manufactured or intended for incorporation into any systems or products intended for use in connection with life support or other hazardous activities or environments in which the failure of the O2Micro products could lead to death, bodily injury, or property or environmental damage ("High Risk Activities"). O2Micro hereby disclaims all warranties, and O2Micro will have no liability to Customer or any third party, relating to the use of O2Micro products in connection with any High Risk Activities. Any support, assistance, recommendation or information (collectively, "Support") that O2Micro may provide to you (including, without limitation, regarding the design, development or debugging of your circuit board or other application) is provided "AS IS." O2Micro does not make, and hereby disclaims, any warranties regarding any such Support, including, without limitation, any warranties of merchantability or fitness for a particular purpose, and any warranty that such Support will be accurate or error free or that your circuit board or other application will be operational or functional. O2Micro will have no liability to you under any legal theory in connection with your use of or reliance on such Support. COPYRIGHT (c) 2005-2008, O2Micro International Limited www..com OZ826-SF-v1.0 Page 7 |
Price & Availability of OZ826
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |